The interconnect decisions you make today will define the performance, efficiency, and scalability of your AI data center for years to come. This session is designed to give you the clarity and technical insight you need before your next design, upgrade, or AI back-end project begins.
Drawing on field experience and performance expectations from large-scale AI deployments, Siemon’s experts will provide a practical, cabling-led view of how to deploy networks that meet today’s demands and are ready scalable for what’s next.
What we’ll cover:
AI Market Overview and Nomenclature
Reference Designs and Deployment Sizes
Cabling Options and Efficiency
What you’ll walk away with:
This is the must-see tech talk for anyone planning, designing or deploying high-density AI data centers. Don’t miss your chance to get the insight that can accelerate your next project and keep your infrastructure ready for the demands ahead.
RegisterRyan Harris
Director of Sales Engineering
Ryan Harris is the Director of Sales Engineering with Siemon, headquartered in Watertown, CT. Ryan has over 12 years’ experience as a customer facing Sales Engineer supporting network equipment OEM’s, hyperscale end-users, ODM’s and system integrators with point-to-point cabling solutions. Specializing in deployment of server system connections in both data center and telecommunication environments. Having a strong understanding of Top-of-Rack applications and a track record of staying up to speed with emerging technologies Ryan communicates technical benefits to provide best-in-class core DC and Edge solutions. With a goal to help Network Engineers understand their options to deploy systems on-time and on budget with attention to detail and a strong customer service ethic.