The rapid growth of Generative AI, projected to attract $1.4 trillion in investment by 2027 and already adopted by over 70% of organizations, presents significant integration challenges. Specifically, 82% of respondents in a Flexential survey reported struggles with bandwidth limitations, unreliable connectivity, and difficulties scaling data center capacity and power. The fast-paced evolution of AI and the confusing landscape of conflicting recommendations further complicate infrastructure decisions.
As a data center manager, you need straightforward, impartial information to help you navigate topology and cabling options and effectively integrate AI based on your specific objectives and environments.
The Two Faces of AI Networking
To handle HPC workloads like Gen AI training, cloud and large enterprise data centers must implement back-end networks that enable ultra-high-speed, low-latency data transmission within AI pods or clusters. Simultaneously, traditional front-end networks must maintain seamless connectivity for general-purpose workloads and efficient data transfer to and from back-end networks. This dual approach is essential for accelerating AI inference requests and improving the overall user experience.
In back-end networks, modern spine-leaf architectures facilitate low-latency east-west traffic between interconnected GPU nodes. Spine and leaf switches connect at 800 Gigabit (G) Ethernet, with 1.6 Terabit (T) Ethernet speeds on the horizon, and leaf switches connect to nodes using 400G Ethernet or InfiniBand. Meanwhile, front-end networks are rapidly transitioning to 200G and 400G Ethernet for switch-to-switch links and 25G, 50G, and 100G Ethernet for switch-to-server connections.
Consequently, data center managers must carefully select the appropriate topology and cabling for four distinct network connection areas versus types: back-end switch-to-switch, back-end switch-to-node, front-end switch-to-switch, and front-end switch-to-server.
Selecting the Right Topology and Cabling
Back-end and front-end network infrastructure topologies utilize point-to-point or structured cabling across varying distances. Switch-to-switch and switch-to-server links can also leverage breakout configurations to optimize port density and space. When selecting the appropriate topology and cabling, data center managers must consider space, layout, flexibility, scalability, power, cooling, latency, and loss performance.
From edge AI deployments to large-scale training clusters, Siemon’s AI-ready cabling solutions ensure seamless, high-performance connectivity across both back-end and front-end networks. With a complete portfolio of structured cabling, direct attach, and high-speed fiber solutions, Siemon provides the reliability, scalability, and flexibility needed to support the next generation of AI workloads.
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Author:
Gary Bernstein, RCDD, CDCD
Sr. Director, Global Data Center Solutions, Siemon
Gary Bernstein is Sr. Director of Global Data Center Sales at Siemon with more than 25 years of industry experience and extensive knowledge in data center infrastructure, telecommunications, and copper and fiber structured cabling systems. Gary has held positions in engineering, sales, product management, marketing and corporate management throughout his career. Gary has been a member of TIA TR42.7 and TR42.11 Copper and Fiber Committees and various IEEE802.3 task forces and study groups including 40/100G “ba”, 200/400G “bs” and 400/800G “df” and 800G/1.6T “dj”. Gary has spoken on Data Center Cabling at several industry events in North America, Europe, LATAM and APAC including 7×24, AFCOM, BICSI, Cisco Live, Datacenter Dynamics and has authored several articles in industry trade publications. Gary received a Bachelor of Sciences in Mechanical Engineering from Arizona State University, is an RCDD with BICSI and a Certified Data Center Designer (CDCD) with Datacenter Dynamics.
Co-Author:
Ryan Harris
Director of Sales Engineering – High-Speed Cable Assemblies, Siemon
Ryan Harris is the Director of Sales Engineering with Siemon, headquartered in Watertown, CT. Ryan has over 12 years’ experience as a customer facing Sales Engineer supporting network equipment OEM’s, hyperscale end-users, ODM’s and system integrators with point-to-point cabling solutions. Specializing in deployment of server system connections in both data center and telecommunication environments. Having a strong understanding of Top-of-Rack applications and a track record of staying up to speed with emerging technologies, Ryan communicates technical benefits to provide best-in-class core DC and Edge solutions. With a goal to help Network Engineers understand their options to deploy systems on time and on budget with attention to detail and a strong customer service ethic.
Gary Bernstein
Global Data Center Cabling Solutions Specialist, Siemon
Gary Bernstein is Sr. Director of Global Data Center Sales at Siemon with more than 25 years of industry experience and extensive knowledge in data center infrastructure, telecommunications, and copper and fiber structured cabling systems. Gary has held positions in engineering, sales, product management, marketing and corporate management throughout his career. Gary has been a member of TIA TR42.7 and TR42.11 Copper and Fiber Committees and various IEEE802.3 task forces and study groups including 40/100G “ba”, 200/400G “bs” and 400/800G “df” and 800G/1.6T “dj”. Gary has spoken on Data Center Cabling at several industry events in North America, Europe, LATAM and APAC including 7x24, AFCOM, BICSI, Cisco Live, Datacenter Dynamics and has authored several articles in industry trade publications. Gary received a Bachelor of Sciences in Mechanical Engineering from Arizona State University, is an RCDD with BICSI and a Certified Data Center Designer (CDCD) with Datacenter Dynamics.
