For Immediate Release - July 16, 2010
Siemon Announces New 40+Gb/s QSFP+ Passive Copper Cabling Assemblies for High-Speed Data Center Interconnect Applications
4-lane low latency interconnect solution provides up to 10+Gb/s of bandwidth per lane tosupport server blade to box, rack-to-rack and shelf-to-shelf interconnects as well as high-speed networking and storage equipment applications.
Watertown, Connecticut — Siemon, a leading global manufacturer of IT network cabling and infrastructure systems, announces the release of their 40 Gb/s 40+Gb/s QSFP+ (Quad Small Form-Factor Pluggable Plus) passive copper cabling products. These shielded 4-lane copper cable assemblies were developed as a cost-effective, low-power option for high-speed data center interconnects up to 10 meters, ideal for applications such as high-performance computing (HPC), enterprise networking, video networking and network storage systems.
The QSFP+ form factor interface can replace up to four standard SFP+ connections, providing greater port density and reduced system cost. Advanced design and manufactring processes, such as precision wire stripping and a unique automated termination process result in optimized cross talk and Return Loss. The same automated processes result in Siemon's QSFP+ assembly's consistent and industry leading signal integrity performance.
Interoperable with compliant SFF-8436 interfaces, Siemon's QSFP+ copper interconnects are fully compatible with a wide array of data protocols/interfaces, including InfiniBand 4X SDR, DDR, QDR and FDR as well as Ethernet 10G, 40G (IEEE-802.3ba) and SONET electrical failover 40G links. They also support Fibre Channel SAN 10G, 40G and SAN; RapidIO and Myrinet 40G systems links. Other applications include CameraLink2 Video Vision networking, Digital Signage networking, Converged and Unified fabric networking as well as NUMA, QSnet, AuroraIO, RocketIO, StratixIO, VITA-55 and VITA-VXS systems links.
Siemon also offers application specific assembly solutions integrating QSFP+ interfaces in hybrids, hydras and other value-added configurations as well as varied EEPROM programming options, wire gauges and assembly lengths.
This interconnect is part of the Siemon's high speed connectivity products that include Moray QSFP+ AOC's and MTP Plug and Play solutions as well as a variety of innovative category cabling products.
- About Siemon
- Established in 1903, Siemon is an industry leader specializing in the design and manufacture of high quality, high performance IT infrastructure solutions and services for Data Centers, LANs and Intelligent Buildings. Headquartered in Connecticut, USA, with global sales, technical and logistics expertise spanning 100 countries, Siemon offers the most comprehensive suites of copper and optical fiber cabling systems, cabinets, racks, cable management, data center power and cooling systems and Intelligent Infrastructure Management solutions. With more than 400 patents specific to structured cabling, Siemon Labs invests heavily in R&D and the development of Industry Standards, underlining the company's long-standing commitment to its customers and the industry. Through an ongoing commitment to waste and energy reduction, Siemon's environmental sustainability benchmarks are unparalleled in the industry, including 179% global carbon negativity and zero-landfill status
- Siemon Interconnect Solutions (SIS) is a Siemon business unit comprised of a team of dedicated technical sales professionals supported by Siemon Labs, mechanical, electrical and signal integrity engineers committed to solving industry and customer driven interconnect challenges. We provide custom network infrastructure solutions to: OEM's, Leading Manufacturers, Value-Added Resellers and System Integrators.
- Press Contact:
- Betsy Conroy
- (860) 945-4200