For Immediate Release - July 16, 2010
Siemon Announces New 40+Gb/s QSFP+ Passive Copper Cabling Assemblies for High-Speed Data Center Interconnect Applications
4-lane low latency interconnect solution provides up to 10+Gb/s of bandwidth per lane tosupport server blade to box, rack-to-rack and shelf-to-shelf interconnects as well as high-speed networking and storage equipment applications.
Watertown, Connecticut — Siemon, a leading global manufacturer of IT network cabling and infrastructure systems, announces the release of their 40 Gb/s 40+Gb/s QSFP+ (Quad Small Form-Factor Pluggable Plus) passive copper cabling products. These shielded 4-lane copper cable assemblies were developed as a cost-effective, low-power option for high-speed data center interconnects up to 10 meters, ideal for applications such as high-performance computing (HPC), enterprise networking, video networking and network storage systems.
The QSFP+ form factor interface can replace up to four standard SFP+ connections, providing greater port density and reduced system cost. Advanced design and manufactring processes, such as precision wire stripping and a unique automated termination process result in optimized cross talk and Return Loss. The same automated processes result in Siemon's QSFP+ assembly's consistent and industry leading signal integrity performance.
Interoperable with compliant SFF-8436 interfaces, Siemon's QSFP+ copper interconnects are fully compatible with a wide array of data protocols/interfaces, including InfiniBand 4X SDR, DDR, QDR and FDR as well as Ethernet 10G, 40G (IEEE-802.3ba) and SONET electrical failover 40G links. They also support Fibre Channel SAN 10G, 40G and SAN; RapidIO and Myrinet 40G systems links. Other applications include CameraLink2 Video Vision networking, Digital Signage networking, Converged and Unified fabric networking as well as NUMA, QSnet, AuroraIO, RocketIO, StratixIO, VITA-55 and VITA-VXS systems links.
Siemon also offers application specific assembly solutions integrating QSFP+ interfaces in hybrids, hydras and other value-added configurations as well as varied EEPROM programming options, wire gauges and assembly lengths.
This interconnect is part of the Siemon's high speed connectivity products that include Moray QSFP+ AOC's and MTP Plug and Play solutions as well as a variety of innovative category cabling products.
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About Siemon:
Established in 1903, Siemon (www.siemon.com) is a global industry leader in the development and manufacture of high quality, high-performance network cabling solutions. Siemon's Interconnect Solutions business unit (SIS) specializes in the development of high-speed interconnects. Headquartered in Watertown, Connecticut, USA, Siemon operates directly in over 30 countries and, through its channels, services customers in over 100 countries. Siemon offers a comprehensive suite of copper and optical fiber cabling systems. With over 400 patents, Siemon Labs invests heavily in R&D and is actively involved with numerous industry standards organizations around the world.
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